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1. Selection of high-quality materials, no rust, high toughness, and corrosion resistance.
2. The surface adopts vacuum plating process, which will not fade.
3. Laser high-precision cutting, neat edges without burrs, uniform shape.
4. The blade is polished by hand, carefully polished by the first-line maintenance master, and directly used without polishing.
5. Ma1.0 can be used to pry IC and CPU glue removal.
6. Ma2.0 is a corner knife, which can be used to scrape the glue around the IC.
7. Ma3.0 is a special-shaped rubber tapping knife, which can cut vinyl without damaging the board.
2. The surface adopts vacuum plating process, which will not fade.
3. Laser high-precision cutting, neat edges without burrs, uniform shape.
4. The blade is polished by hand, carefully polished by the first-line maintenance master, and directly used without polishing.
5. Ma1.0 can be used to pry IC and CPU glue removal.
6. Ma2.0 is a corner knife, which can be used to scrape the glue around the IC.
7. Ma3.0 is a special-shaped rubber tapping knife, which can cut vinyl without damaging the board.
Specification:
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