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1. Intelligent temperature control
2. Protect Motherboard, Desoldering PCBA Easily
3. Dual button design, adopting intergrated design of PCBA soldering and desoldering
4. Support: for iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro/12 Pro Max
5. Adopting AC high-frequency heating, PID temperature algorithm, temperature rising faster and more accurate.
6. Adopt Magnetic Flip design, start dormancy mode by automatic induction, better protection for users.
7. Adopting Layer-Fit Integrated Design Scheme, to stretch the deformed PCBA easily for heating fit by buckle lock.
2. Protect Motherboard, Desoldering PCBA Easily
3. Dual button design, adopting intergrated design of PCBA soldering and desoldering
4. Support: for iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro/12 Pro Max
5. Adopting AC high-frequency heating, PID temperature algorithm, temperature rising faster and more accurate.
6. Adopt Magnetic Flip design, start dormancy mode by automatic induction, better protection for users.
7. Adopting Layer-Fit Integrated Design Scheme, to stretch the deformed PCBA easily for heating fit by buckle lock.
Specification:
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